Silica powder

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■ Brief Introduction

Silicon powder has the properties of high whiteness, high purity, ultra-fine, uniform particle size, high insulation, high thermal conductivity, high weather resistance, acid and alkali resistance. Compared with other similar products, it has a greater price advantage, and is widely used in high-end electronic potting adhesives, electronic thermal conductivity adhesives, silicone rubber, adhesives, inks, coatings, plastics and precision casting fields.

■ Product Features

• Good filling property, good fullness and good color

• Very high whiteness, very low water content, good insulation

• Improve the bond strength, yield value and shear dilution index of the product

• It has good fluidity, levelability and thixotropy

■ SEM

■ Product technical parameters

Products Name：Silica powder

Product Name	Model No.	Whiteness	D50 (μm)	D90 (μm)	Oil absorption value (g/100g)	pH	Moisture (%)	Loss on Ignition (%)
Crystalline silica powder	HY-G0	85±2	16.55	42.88	15-30	7.0-9.0	≤0.50	≤0.5
	HY-G5	89±2	11.38	27.84	20-35	7.0-9.0	≤0.50	≤0.5
	HY-G7	90±2	8.54	16.85	20-35	7.0-9.0	≤0.50	≤0.5
	HY-G10	92±2	4.55	10.15	20-35	7.0-9.0	≤0.50	≤0.5
	HY-G12	92±2	2.64	5.22	30-40	7.0-9.0	≤0.50	≤0.5
Fused silica powder	HY-GF	95±2	7.14	16.84	30-38	7.0-9.0	≤0.50	≤0.50
Soft composite silica powder	HY-SS05	≥90	4.0-5.0	13.0-15.0	/	/	/	/
	Copper clad laminate, Silicone rubber, LED packaging, Modified plastics
Cristobalite powder	HY-3000	98.4	16	38	25	9	0.2	0.1
	HY-4000	98.8	6	14	28	9	0.2	0.1
	HY-6000	98.9	3.7	8.4	30	9	0.3	0.2
	Precision manufacturing, Jewelry casting, Dental materials, Polishing materials, Coatings, Adhesives

The specific product values are subject to the actual factory inspection report.

Products Name：Spherical silica powder

Product Name	Model No.	Whiteness	D50 (μm)	Electrical conductivity (μS/cm)	pH	200-mesh water sieve residue (ppm)	Sphericity (%)
Spherical silica powder	HY-SSP002	≥90.00	1.50-2.50	≤20.00	4.80-7.20	≤200	≥90
	HY-SSP005	≥90.00	3.00-6.00	≤5.00	4.80-7.20	≤100	≥90
	HY-SSP007	≥90.00	5.00-8.00	≤5.00	4.80-7.20	≤500	≥90
	HY-SSP0100	≥90.00	9.00-15.00	≤5.00	4.80-7.20	≤500	≥90
	HY-SSP0200	≥90.00	18.00-25.00	≤5.00	4.80-7.20	≤500	≥90
	HY-SSP0300	≥90.00	28.00-35.00	≤5.00	4.80-7.20	≤100	≥90
	HY-SSP0400	≥90.00	36.00-44.00	≤5.00	4.80-7.20	≤500	≥90
	Epoxy molding compound, filler for copper clad laminate, electronic adhesive

The specific product values are subject to the actual factory inspection report.

■ Main applications

• Modified plastics

• Rubber

• Coatings

• Printing inks

• Adhesives