Brief Introduction
Silicon powder has the properties of high whiteness, high purity, ultra-fine, uniform particle size, high insulation, high thermal conductivity, high weather resistance, acid and alkali resistance. Compared with other similar products, it has a greater price advantage, and is widely used in high-end electronic potting adhesives, electronic thermal conductivity adhesives, silicone rubber, adhesives, inks, coatings, plastics and precision casting fields.
Product Features
Good filling property, good fullness and good color
Very high whiteness, very low water content, good insulation
Improve the bond strength, yield value and shear dilution index of the product
It has good fluidity, levelability and thixotropy
Scanning Electron Microscope (SEM)
Product Technical Parameters
Products Name: Silica powder
← Scroll left and right to view more parameters →
| Silica Powder Technical Parameters | ||||||||
|---|---|---|---|---|---|---|---|---|
| Product Name | Model No. | Whiteness | D50 (μm) | D90 (μm) | Oil absorption value (g/100g) | pH | Moisture (%) | Loss on Ignition (%) |
| Crystalline silica powder | HY-G0 | 85±2 | 16.55 | 42.88 | 15-30 | 7.0-9.0 | ≤0.50 | ≤0.5 |
| HY-G5 | 89±2 | 11.38 | 27.84 | 20-35 | 7.0-9.0 | ≤0.50 | ≤0.5 | |
| HY-G7 | 90±2 | 8.54 | 16.85 | 20-35 | 7.0-9.0 | ≤0.50 | ≤0.5 | |
| HY-G10 | 92±2 | 4.55 | 10.15 | 20-35 | 7.0-9.0 | ≤0.50 | ≤0.5 | |
| HY-G12 | 92±2 | 2.64 | 5.22 | 30-40 | 7.0-9.0 | ≤0.50 | ≤0.5 | |
| Fused silica powder | HY-GF | 95±2 | 7.14 | 16.84 | 30-38 | 7.0-9.0 | ≤0.50 | ≤0.50 |
| Soft composite silica powder | HY-SS05 | ≥90 | 4.0-5.0 | 13.0-15.0 | / | / | / | / |
| Applicable categoryCopper clad laminate, Silicone rubber, LED packaging, Modified plastics | ||||||||
| Cristobalite powder | HY-3000 | 98.4 | 16 | 38 | 25 | 9 | 0.2 | 0.1 |
| HY-4000 | 98.8 | 6 | 14 | 28 | 9 | 0.2 | 0.1 | |
| HY-6000 | 98.9 | 3.7 | 8.4 | 30 | 9 | 0.3 | 0.2 | |
| Applicable categoryPrecision manufacturing, Jewelry casting, Dental materials, Polishing materials, Coatings, Adhesives | ||||||||
The specific product values are subject to the actual factory inspection report.
Products Name: Spherical silica powder
← Scroll left and right to view more parameters →
| Spherical Silica Powder Technical Parameters | |||||||
|---|---|---|---|---|---|---|---|
| Product Name | Model No. | Whiteness | D50 (μm) | Electrical conductivity (μS/cm) | pH | 200-mesh water sieve residue (ppm) | Sphericity (%) |
| Spherical silica powder | HY-SSP002 | ≥90.00 | 1.50-2.50 | ≤20.00 | 4.80-7.20 | ≤200 | ≥90 |
| HY-SSP005 | ≥90.00 | 3.00-6.00 | ≤5.00 | 4.80-7.20 | ≤100 | ≥90 | |
| HY-SSP007 | ≥90.00 | 5.00-8.00 | ≤5.00 | 4.80-7.20 | ≤500 | ≥90 | |
| HY-SSP0100 | ≥90.00 | 9.00-15.00 | ≤5.00 | 4.80-7.20 | ≤500 | ≥90 | |
| HY-SSP0200 | ≥90.00 | 18.00-25.00 | ≤5.00 | 4.80-7.20 | ≤500 | ≥90 | |
| HY-SSP0300 | ≥90.00 | 28.00-35.00 | ≤5.00 | 4.80-7.20 | ≤100 | ≥90 | |
| HY-SSP0400 | ≥90.00 | 36.00-44.00 | ≤5.00 | 4.80-7.20 | ≤500 | ≥90 | |
| Applicable categoryEpoxy molding compound, filler for copper clad laminate, electronic adhesive | |||||||
The specific product values are subject to the actual factory inspection report.
Main Applications
Modified plastics
Rubber
Coatings
Printing inks
Adhesives
