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Aluminum Oxide - Guangdong Hico New Materials
KEY INDICATORS
Product Key Indicators
Overview of key performance parameters of alumina
29.3W
Max Thermal Conductivity
W/(K·m)
10Models
Premium Selection
Angular 2 + Spherical 8
≥95%
Sphericity
Higher Packing Density
2054℃
Melting Point
High Temperature Stability
PRODUCT ADVANTAGES
Alumina Four Core Advantages
High Thermal Conductivity · High Whiteness & Purity · Uniform Particle Size · High Temperature Resistance
01
🔥
High Thermal Conductivity · Preferred Thermal Filler
Thermal conductivity up to 20.5-29.3 W/(K·m), ideal filler for thermally conductive silicone, thermal adhesives, and other products. Spherical alumina sphericity ≥95%, higher packing density, superior thermal pathways.
02
✨
High Whiteness · High Purity
Alumina whiteness ≥90 (A-CG-300-MS), spherical alumina whiteness ≥90, chemical formula Al₂O₃ with extremely high purity, ionizable ionic crystal at high temperatures, ensuring stability and consistency in filled systems.
03
📏
Uniform Particle Size · Precise Control
Spherical alumina 8 models cover D50 1.2~90μm full range, narrow particle size distribution (±0.3~±5μm), allowing precise selection for different viscosity and filling requirements to ensure optimal thermal performance.
04
🌡
High Temperature Resistance · Stable & Reliable
Alumina melting point 2054℃, boiling point 2980℃, stable performance without decomposition in high temperature environments, true density 3.85 g/cm³, ensuring long-term reliability in high temperature applications.
ALUMINA ADVANTAGES
Alumina Core Advantages
High Thermal Conductivity · High Purity · Sphericity ≥95% · High Temp Resistance 2054℃

🔥 Thermal Conductivity Principle of Alumina

Aluminum oxide (Al₂O₃) is a high hardness inorganic compound with a melting point of 2054℃, boiling point of 2980℃, and thermal conductivity up to 20.5-29.3 W/(K·m). Spherical alumina is produced through a high-temperature spheroidization process, converting irregular particles into spherical elastomers with sphericity ≥95%, higher packing density, and superior thermal pathways, making it the preferred material for thermal filling applications.

🔥
High Thermal Conductivity
20.5-29.3 W/(K·m), preferred material for thermal filling
📏
8 Particle Sizes Precise Coverage
D50 1.2~90μm, meeting different viscosity and filling requirements
🎯
Sphericity ≥95%
Spherical alumina with high packing density, superior thermal pathways
✨
High Whiteness · High Purity
Whiteness ≥90, Al₂O₃ with extremely high purity, excellent chemical stability
🌡
High Temp Resistance 2054℃
Stable without decomposition at high temperatures, long-term reliability guaranteed
💧
Ultra-Low Moisture
Spherical series moisture ≤0.03~0.05%, no effect on bonding strength
PRODUCT TYPE
Two Major Series for Precise Selection
Aluminum Oxide · Spherical Aluminum Oxide — Covering Rubber / Adhesives / Thermal Filling Applications

🔥 Thermal Conductivity Principle & Selection Guide

Aluminum oxide (Al₂O₃) is a high hardness inorganic compound with a melting point of 2054℃, boiling point of 2980℃, and thermal conductivity up to 20.5-29.3 W/(K·m). Spherical alumina is produced through a high-temperature spheroidization process, converting irregular particles into spherical elastomers with sphericity ≥95%, true density 3.85 g/cm³, higher packing density, superior thermal pathways, making it the preferred material for thermal filling applications.

Alumina Microstructure Diagram
Angular Aluminum Oxide
High Purity · High Whiteness · For Thermal Filling
A-C-300-MS A-CG-300-MS
Thermal Cond.: 20.5-29.3 W
Whiteness: 85±2 / ≥90
D50: 4.78~55.51μm
Oil Absorption: 20-36
Spherical Spherical Aluminum Oxide
Sphericity ≥95% · Optimal Thermal Conductivity · 8 Models for Precise Selection
HY-SAP01 HY-SAP02 HY-SAP05 HY-SAP10 HY-SAP20 HY-SAP40 HY-SAP70 HY-SAP90
Sphericity: ≥95%
Whiteness: ≥88~≥90
D50: 1.2~90μm
True Density: 3.85 g/cm³
⚠
Selection Guide: For thermal filling, Spherical Aluminum Oxide is the preferred choice (sphericity ≥95%, high packing density, optimal thermal pathways). For low-viscosity systems, HY-SAP01/02/05 is recommended (D50 only 1.2~6.0μm). For high-filling systems, HY-SAP70/90 is recommended (D50 up to 70~90μm). For general thermal scenarios, A-CG-300-MS is suitable (whiteness ≥90, D50=4.78μm). The specific product values are subject to the actual factory inspection report.
TECHNICAL PARAMETERS
Product Technical Parameters
Full Series Parameters — Aluminum Oxide 2 Models + Spherical Aluminum Oxide 8 Models
📊 Aluminum Oxide (Angular)
Model No. Whiteness D50
(μm)		 D90
(μm)		 Oil Absorption Value
(g/100g)		 Moisture
(%)		 Loss on Ignition
(%)
A-C-300-MS 85±2 55.51 110.94 36 0.2 ≤0.30
A-CG-300-MS ≥90 4.78 11.5 20-35 0.27 ≤0.30
📋 A-CG-300-MS whiteness ≥90, D50 only 4.78μm, low oil absorption value (20-35), suitable for high-whiteness thermal filling applications. A-C-300-MS has coarser particle size (D50=55.51μm), suitable for high-filling systems. The specific product values are subject to the actual factory inspection report.
📊 Spherical Aluminum Oxide
Model No. Whiteness D50
(μm)		 D90
(μm)		 pH Moisture
(%)		 Conductivity
(μS/cm)		 True Density
(g/cm³)		 Sphericity
(%)
HY-SAP01 ≥90 1.2±0.3 ≤4.50 7.5±1.0 ≤0.03 ≤200 3.85±0.1 ≥95
HY-SAP02 ≥90 2.5±0.4 ≤7.50 7.5±1.0 ≤0.03 ≤100 3.85±0.1 ≥95
HY-SAP05 ≥90 6.0±0.5 ≤17 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
HY-SAP10 ≥88 13±2 ≤35 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
HY-SAP20 ≥90 23±3 ≤50 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
HY-SAP40 ≥90 50±5 ≤90 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
HY-SAP70 ≥88 70±5 ≤115 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
HY-SAP90 ≥88 90±5 ≤135 7.5±1.0 ≤0.05 ≤10 3.85±0.1 ≥95
📋 Spherical aluminum oxide sphericity ≥95%, true density 3.85 g/cm³, ultra-low moisture (≤0.03~0.05%). D50 from 1.2μm to 90μm precisely covered, 8 models meeting different particle size requirements. The specific product values are subject to the actual factory inspection report.
Product Warehouse
Product Inspection
PRODUCT INTRODUCTION
Product Introduction
Alumina · Al₂O₃ · High Thermal Conductivity · High Purity · Sphericity ≥95%

Aluminum oxide is an inorganic substance with the chemical formula Al₂O₃. It is a high hardness compound with a melting point of 2054℃ and a boiling point of 2980℃. It is an ionizable ionic crystal at high temperatures with a thermal conductivity of 20.5-29.3 W/(K·m), commonly used in the manufacturing of thermal conductive materials.

Spherical aluminum oxide is produced through a high-temperature spheroidization process, converting irregular particles into spherical elastomers with sphericity ≥95%, true density 3.85 g/cm³, higher packing density, superior thermal pathways, making it the preferred material for thermal filling applications.

Hico alumina provides 2 series with 10 models. Angular alumina (2 models) is suitable for general thermal scenarios, while spherical alumina (8 models) covers D50 1.2~90μm full range, enabling precise matching for different viscosity and filling requirements to ensure optimal thermal performance.

Al₂O₃ Thermal Conductivity 20.5-29.3 W Melting Point 2054℃ Sphericity ≥95% True Density 3.85 g/cm³ 8 Particle Size Coverage
✓
High Thermal Conductivity
20.5-29.3 W/(K·m), preferred for thermal filling
✓
Sphericity ≥95%
Spherical alumina with high packing density, superior thermal pathways
✓
8 Particle Sizes Precise Coverage
D50 1.2~90μm, meeting different viscosity requirements
✓
High Whiteness · High Purity
Whiteness ≥90, Al₂O₃ with extremely high purity
✓
High Temp Resistance 2054℃
Stable without decomposition at high temperatures
✓
Ultra-Low Moisture
Spherical series moisture ≤0.03~0.05%
APPLICATION AREAS
Three Main Applications
Covering Rubber, Adhesives, Thermal Filling and other core applications
Rubber Application
App 01
Rubber
Adding alumina to rubber products leverages high thermal conductivity and spherical structure to enhance thermal dissipation performance, improve mechanical strength and dimensional stability, suitable for thermal silicone pads, heat-dissipating seals, and other high-end products.
Adhesives Application
App 02
Adhesives
Adding spherical alumina to thermally conductive adhesives, sphericity ≥95% ensures high packing density, superior thermal pathways, ultra-low moisture (≤0.03%) with no effect on bonding strength, suitable for electronic heat dissipation bonding and structural adhesive applications.
Thermal Filling Application
App 03
Thermal Filling
Thermal conductivity 20.5-29.3 W/(K·m), spherical alumina sphericity ≥95%, the preferred material for thermal filling applications such as thermal silicone, thermal potting compounds, and thermally conductive plastics, with 8 models precisely matching different systems.
For product pricing and inspection reports, please contact us
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