Brief Introduction
Thermal conductive composite powder can build a complete thermal conductivity pathway in adhesives, endowing them with good heat dissipation characteristics and also serving terminals, providing new cooling solutions for electronic components and heating components in some cases.
Product Features
Hue white
Good liquidity
Stable thermal storage performance
Excellent thermal conductivity
Product Technical Parameters
Products Name: Thermal conductive composite powder
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| Technical Parameters of Thermal Conductive Composite Powder | |||||||
|---|---|---|---|---|---|---|---|
| Modification type | Model No. | Hue | D50 (μm) | Oil absorption value (g/100g) | Moisture (%) | Viscosity (mPa·s) | Thermal conductivity (W/(m·K)) |
| Single modification | TFP-120J1 | white | 10.56 | 14.1 | 0.07 | A:42300 B:93600 |
1.2±0.1 |
| Applicable Categories | Polyurethane thermally conductive structural adhesive (approx. 1.2 W/m·K) for high-strength applications: shear strength 15.5 MPa, tensile strength 13.0 MPa, elongation at break 40% | ||||||
| Composite modification | TFP-100YJ2 | white | 18.07 | 11 | 0.1 | ≤3500 | 1.0±0.1 |
| Applicable Categories | Silicone addition/condensation type 1.0 W/m·K thermal potting compounds and epoxy 0.6 W/m·K thermal potting compounds, etc. | ||||||
| Composite modification | TFP-150YJ | white | 12.3 | 7.2 | 0.1 | ≤3800 | 1.5±0.1 |
| Applicable Categories | Silicone addition/condensation type 1.5 W/m·K thermal potting compounds and epoxy 1.2 W/m·K thermal potting compounds, etc. | ||||||
| Composite modification | TFP-150J3A | white | 10.5 | 6.2 | 15-30 | A:≤40000 B:≤70000 |
1.2±0.1 |
| Applicable Categories | Polyurethane thermally conductive structural adhesive 1.2 W/m·K, with emphasis on storage stability and thixotropy | ||||||
| Composite modification | ATH-SM08 | white | 8.8 | 14 | 0.1 | / | 0.85±0.15 |
| Applicable Categories | Solid thermally conductive silicone gel, thermal conductivity within 1.0 W/m·K | ||||||
| Composite modification | TFP-300C/ATH-SM15 | white | 8.6 | 6.2 | 0.1 | / | 1.5±0.15 |
| Applicable Categories | Solid thermally conductive silicone gel, thermal conductivity above 1.5 W/m·K | ||||||
The specific product values are subject to the actual factory inspection report.
Main Applications
Epoxy system
Polyurethane system
Organic silicon system
