Thermal conductive composite powder

---

■ Brief Introduction

Thermal conductive composite powder can build a complete thermal conductivity pathway in adhesives,
endowing them with good heat dissipation characteristics and also serving terminals. In some cases Provide new cooling solutions for electronic components and heating components.

■ Product Features

• Hue white

• Good liquidity

• Stable thermal storage performance

• Excellent thermal conductivity

■ Product technical parameters

Products Name：Thermal conductive composite powder

Modification type	Model No.	Hue	D50 (μm)	Oil absorption value (g/100g)	Moisture (%)	Viscosity (mPa·s)	Thermal conductivity (W/(m·K))
Single modification	TFP-120J1	white	10.56	14.1	0.07	A:42300 B:93600	1.2±0.1
	Applicable Categories	Polyurethane thermally conductive structural adhesive (approx. 1.2 W/m·K) for high-strength applications: shear strength 15.5 MPa, tensile strength 13.0 MPa, elongation at break 40%
Composite modification	TFP-100YJ2	white	18.07	11	0.1	≤3500	1.0±0.1
	Applicable Categories	Silicone addition/condensation type 1.0 W/m·K thermal potting compounds and epoxy 0.6 W/m·K thermal potting compounds, etc.
	TFP-150YJ	white	12.3	7.2	0.1	≤3800	1.5±0.1
	Applicable Categories	Silicone addition/condensation type 1.5 W/m·K thermal potting compounds and epoxy 1.2 W/m·K thermal potting compounds, etc.
	TFP-150J3A	white	10.5	6.2	15-30	A:≤40000 B:≤70000	1.2±0.1
	Applicable Categories	Polyurethane thermally conductive structural adhesive 1.2 W/m·K, with emphasis on storage stability and thixotropy
	ATH-SM08	white	8.8	14	0.1	/	0.85±0.15
	Applicable Categories	Solid thermally conductive silicone gel, thermal conductivity within 1.0 W/m·K
	TFP-300C/ATH-SM15	white	8.6	6.2	0.1	/	1.5±0.15
	Applicable Categories	Solid thermally conductive silicone gel, thermal conductivity above 1.5 W/m·K

The specific product values are subject to the actual factory inspection report.

■ Main applications

• Epoxy system

• Polyurethane system

• Organic silicon system